Advance Packaging Process Development Engineer
Taichung - Fab 16onsitemid
Posted today · via Workday
About this role
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JOB DESCRIPTION: Micron’s Assembly Package Process Development team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron’s memory products ramp up including side by side certification with Manufacturing teams.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: teams
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Taichung - Fab 16. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
teams
More at Micron
- View →Director of Hyperscale SalesSeattle, WA
- View →TW ID1 RAM Operations Shift EngineerTaoyuan - Fab 11, Taiwan
- View →FAB Engineer (Wet Process)Manassas, VA - Fab 6
- View →SR MANAGER, FE PRO GLOBAL CAPITALFab 10A, Singapore
- View →IE Layout EngineerMiaoli - Tongluo, Taiwan
- View →ENGINEER, MTB PQA LABTaichung - MTB, Taiwan